MONOFACCIA
Number of layer: 1
Materials: CEM1, FR4, CEM3
Copper thickness (finished): 18μm – 105μm
PCB thickness : 0.63mm – 3,2mm
Maximum dimensions: 546mm x 622mm
Surface finishes available: HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
2 LAYER
Number of layer: 2
Materials: FR-4 standard, FR-4 high performance, FR-4 halogen-free.
Copper thickness (finished): 26,2μm – 108,6μm, advanced 330μm
PCB thickness : 0.40mm – 3.2mm
Maximum dimensions: 546mm x 622mm, advanced 600mm x 1100mm
Surface finishes available: HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
MULTILAYER
Number of layer: 4 – 24 layers
Materials: High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper thickness (finished): 26,2μm – 108,6μm, advanced 330μm
PCB thickness : 0.40mm – 7.0mm
Maximum dimensions: 546mm x 622mm, advanced 600mm x 1100mm
Surface finishes available: HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
RIGIDO-FLESSIBILI
Number of layer: 4-12 layers
Materials: RA copper, HTE copper, FR-4, polyimide, adhesive
Copper thickness (finished): 26,2μm – 108,6μm, advanced 330μm
PCB thickness : 0.4mm – 3mm
PCB thickness in flex section : 0.05mm – 0.8mm
Maximum dimensions: 457mm x 610mm
Surface finishes available: ENIG, OSP Immersion tin, Immersion silver
FLESSIBILI
Number of layer: 1 – 6L
Materials: Polyimide, Polyester
Profile method: Laser cutting, punching, rout
Copper thickness (finished): 18μm – 70μm
PCB thickness : 0.05mm – 0.80mm
Maximum dimensions: 450mm x 610mm
Surface finishes available: OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers
IMS
Number of layer: 1 – 4 layers
Materials: Aluminum & copper plates. FR-4, PTFE, thermal dielectrics.
Profile method: Punching, routing
Copper thickness (finished): 35μm – 140μm
Metal core thickness : 0.40mm – 3.20mm
Maximum dimensions: 550mm x 700mm
Surface finishes available: HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
